cystech electronics corp. spec. no. : c467fp issued date : 2009.03.19 revised date : 2009.10.23 page no. : 1/4 MBR10120FP cystek product specification 10amp. schottky barrier rectifiers i f(av) 2 5a MBR10120FP v rrm 120v tj 175 c v f 0.68v features ? 175 operating junction temperature ? low v f and low i r type ? metal silicon junction, major carrier conduction ? 10a total (5a per diode leg) ? guardring for over voltage protection ? low power loss, high efficiency ? high surge capability ? insulating package, insulating voltage=2000v dc, capacitance=45pf ? high temperature soldering guaranteed : 260 /10s, 0.25?(6.35mm) from case ? for use in low voltage, high frequency inverters, free wheeling, and polarit y protection application ? rohs compliant package mechanical data ? case: jedec to-220fp molded plastic ? mounting position: any ? weight: 2.2 grams, 0.078 ounce approximately ? terminals: pure tin plated, lead-fre e, solderable per mil-std-750 method 2026 ? epoxy: ul 94v-0 rate flame retardant ? mounting torque : 5 in-lbs max equivalent circuit outline MBR10120FP to-220fp a k a
cystech electronics corp. spec. no. : c467fp issued date : 2009.03.19 revised date : 2009.10.23 page no. : 2/4 MBR10120FP cystek product specification maximum ratings and electrical ch aracteristics (per diode leg) ( rating at 25 c ambient temperature unless otherwise sp ecified. single phase, half wave, 60hz, resistive or inductive loa d. for capacitive load, derate current by 20%.) parameter symbol min. typ. max. units maximum recurrent peak reverse voltage v rrm 120 v maximum rms voltage v rms 84 v maximum dc blocking voltage v dc 120 v i f =5a, t c =25 0.92 i f =5a, t c =125 0.68 0.75 i f =10 a, t c =25 1.00 maximum instantaneous forward voltage at (note 1) i f =10a, t c =125 v f 0.85 v per diode 5 maximum average forward rectified current @ t c =142 per device i f(av) 10 a non-repetitive peak forward surge current @ 8.3ms single half sine wave superimposed on rated load (jedec method) i fsm 120 a peak repetitive reverse surge current , t j <175 (note 1 ) i rrm 2 a v r =120 v, t c =25 5 a maximum instantaneous reverse current at v r =120 v, t c =125 i r 5 ma voltage rate of change, (rated v r ) dv/dt 10,000 v/ s typical junction capacitance @ f=1mhz and applied 5v reverse voltage c j 81 pf esd susceptibility (note 2) 8000 v storage temperature range t stg -65 +175 operating junction temperature range t j -65 +175 notes : 1. 2.0 s pulse width, f=1.0khz 2. human body model, 1.5k in series with 100pf thermal data parameter symbol value unit maximum thermal resistance, junction-to-case r th,j-c 2.5 c/w lead temperature for soldering purpos es : 1/8? from case for 5seconds t l 260 c ordering information device package shipping marking MBR10120FP to-220fp (rohs compliant package) 50 pcs / tube, 40 tubes/box 10120
cystech electronics corp. spec. no. : c467fp issued date : 2009.03.19 revised date : 2009.10.23 page no. : 3/4 MBR10120FP cystek product specification characteristic curves forward current derating curve 0 1 2 3 4 5 6 0 25 50 75 100 125 150 175 case temperature---t c () average forward current---io(a) resistive or inductive load per leg forward current vs forward voltage 1 10 100 1000 10000 100000 0 0.2 0.4 0.6 0.8 1 1.2 1.4 forward voltage---v f (v) instantaneous forward current---i f (ma) pulse width=300s, 1% duty cycle tj=25 tj=150 per leg reverse leakage current vs reverse voltage 0.01 0.1 1 10 100 1000 0 20 40 60 80 100 120 140 160 reverse voltage---v r (v) reverse leakage current---i r (a) tj=75 t j =25 tj=125 per leg junction capacitance vs reverse voltage 10 100 1000 0.1 1 10 reverse voltage---v r (v) junction capacitance---c j (pf) tj=25, f=1.0mhz per leg
cystech electronics corp. spec. no. : c467fp issued date : 2009.03.19 revised date : 2009.10.23 page no. : 4/4 MBR10120FP cystek product specification to-220fp dimension *: typical style: pin 1.anode 2.cathode 3.anode 1 2 3 marking: a k a date code device name 3-lead to-220fp plastic package cystek package code: fp inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.3740 0.4134 9.50 10.50 e2 0.0984 0.1063 2.50 2.70 a1 *0.2756 *7.00 n1 0.0961 0.1039 2.44 2.64 b 0.6063 0.6299 15.40 16.00 n2 0.1921 0.2079 4.88 5.28 b1 0.2480 0.2717 6.30 6.90 p 0.0984 0.1142 2.50 2.90 b2 0.0984 0.1181 2.50 3.00 l 0.5276 0.5354 13.40 13.60 c 0.0138 0.0295 0.35 0.75 l1 0.1378 0.1772 3.50 4.50 d 0.0276 0.0354 0.70 0.90 i 0. 1181 0.1339 3.00 3.40 d1 0.0394 0.0551 1.00 1.40 t 0.0059 0.0138 0.15 0.35 e1 0.1693 0.1850 4.30 4.70 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: kfc ; tin plated ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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